| 摘要 |
An instrument for the electrical connection of predetermined areas of a plate of semiconductor material to metal terminals by portions of wire (6). It includes a bonding head (7) with an ultrasound transducer (1) which makes a capillary tube (3), through which the wire runs, vibrate along a predetermined direction. In order to improve the quality of the bonding of the wire (6) to the metal terminals (8''), a resonator is provided (4) for making the end of the ultrasound transducer (1), to which the capillary tube (3) is fixed, vibrate along a direction perpendicular to that of the vibrations induced by the transducer itself. <IMAGE> |
