发明名称 |
Temperature regulation apparatus |
摘要 |
<p>The present invention relates to a temperature regulation apparatus capable of easily regulating the temperature of a support for a substance to be treated, such as a semiconductor wafer. The temperature regulation apparatus 30 includes a liquid nitrogen supply device 34 for supplying liquid nitrogen into a temperature regulation space 32 provided in the inside of a support 16 so as to effect flashing of the liquid nitrogen. A heating device 46 for heating the support 16 and temperature sensors 58,60 for detecting the temperature of the support 16 are also provided. A temperature setting device 64 sets the temperature of the support 16 at a desired temperature and a controller 44 controls the liquid nitrogen supply device 34 and the heating device 46 based on a temperature detected by the temperature sensors 58, 60, so that the support 16 reaches and is maintained at the set temperature.</p> |
申请公布号 |
EP0776988(A2) |
申请公布日期 |
1997.06.04 |
申请号 |
EP19960402508 |
申请日期 |
1996.11.21 |
申请人 |
AIR LIQUIDE JAPAN, LTD. |
发明人 |
KAWAMURA, HIDEKI;YAMAMOTO, HIROCHIKA;NISHIKAWA, YUKINOBU |
分类号 |
C23C14/54;C23C16/46;G05D23/19;H01L21/00;H01L21/203;H01L21/302;H01L21/3065;H01L21/683;(IPC1-7):C23C14/50;C23C16/44;C23F4/00 |
主分类号 |
C23C14/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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