发明名称 Temperature regulation apparatus
摘要 <p>The present invention relates to a temperature regulation apparatus capable of easily regulating the temperature of a support for a substance to be treated, such as a semiconductor wafer. The temperature regulation apparatus 30 includes a liquid nitrogen supply device 34 for supplying liquid nitrogen into a temperature regulation space 32 provided in the inside of a support 16 so as to effect flashing of the liquid nitrogen. A heating device 46 for heating the support 16 and temperature sensors 58,60 for detecting the temperature of the support 16 are also provided. A temperature setting device 64 sets the temperature of the support 16 at a desired temperature and a controller 44 controls the liquid nitrogen supply device 34 and the heating device 46 based on a temperature detected by the temperature sensors 58, 60, so that the support 16 reaches and is maintained at the set temperature.</p>
申请公布号 EP0776988(A2) 申请公布日期 1997.06.04
申请号 EP19960402508 申请日期 1996.11.21
申请人 AIR LIQUIDE JAPAN, LTD. 发明人 KAWAMURA, HIDEKI;YAMAMOTO, HIROCHIKA;NISHIKAWA, YUKINOBU
分类号 C23C14/54;C23C16/46;G05D23/19;H01L21/00;H01L21/203;H01L21/302;H01L21/3065;H01L21/683;(IPC1-7):C23C14/50;C23C16/44;C23F4/00 主分类号 C23C14/54
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