发明名称 Moulding die for manufacturing electromagnetic sensor and sensor so manufactured
摘要 An electromagnetic sensor formed by integral resin molding of a sensing device 2 in which a pointed reduced diameter upper portion protrusion 26 and an apertured protrusion 28 for positioning capable of complementally engagement to each other are provided one at an axial end face of the sensing device 2 and the other at an inner surface of an upper molding die 20. A plurality of circumferentially spaced apart axially extending portions 22 in an intimate contact with an inner circumference of recess 23 of a lower molding die 19 are provided to the outer circumference at a lower portion of a bobbin 7 of the sensing device 2. The positioning protrusion 26 c portion 29 that is shaped such that the size in a direction perpendicular to a streamline of the resin is gradually decreased (see Figure 7) as it recedes from a resin injection gate 21 in a radial direction. The sensing device is positioned stably in the molding die 19,20, resin molding can be applied through gaps G1,G2, as far as the top end 10a of the pole piece 10 to provide protection, and water proofness of the sensor is improved by intact contact with the resin.
申请公布号 GB2307661(A) 申请公布日期 1997.06.04
申请号 GB19960024496 申请日期 1996.11.26
申请人 * HONDA LOCK MANUFACTURING CO LTD 发明人 KAZUYA * KARINO;KAZUO * YUHI
分类号 B29C33/12;B29C45/14;G01P1/02;(IPC1-7):B29C45/14;B29D31/00 主分类号 B29C33/12
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