发明名称 |
Hot melt adhesive |
摘要 |
Hot melt packaging adhesive compositions comprising a blend of about 20% to about 50% by weight of an ethylene vinyl acetate copolymer containing from about 15% to about 45% by weight vinyl acetate and having a melt index of less than about 700; about 20% to about 60% by weight of a tackifying resin selected from the group of aliphatic and cycloaliphatic and aromatic hydrocarbon resins and hydrogenated derivatives thereof, and rosin and rosin derivatives, and terpenes and terpene derivatives; about 10% to about 40% by weight of a paraffin wax having a melt point of about 55 DEG C to about 85 DEG C; up to about 20% by weight of a synthetic high melting wax; and about 0% to about 1.5% by weight of an antioxidant is useful for application at temperatures of less than about 154 DEG C. The adhesive is characterized by superior bonding performance, and suprisingly has a viscosity useful for low application temperatures and a density of less than about 0.98. |
申请公布号 |
EP0776955(A1) |
申请公布日期 |
1997.06.04 |
申请号 |
EP19960118847 |
申请日期 |
1996.11.25 |
申请人 |
H.B. FULLER LICENSING & FINANCING, INC. |
发明人 |
ALBRECHT, STEVEN;KUEPPERS, MICHELLE |
分类号 |
C09J123/08;C09J131/04;C09J191/06;C09J193/00;C09J193/04 |
主分类号 |
C09J123/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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