| 摘要 |
<p>A method for manufacturing a thick film circuit substrate, has the steps of: coating paste (2) onto a substrate (1) to form a thick paste film; drying the paste film on the substrate (1); irradiating a laser beam (7) on the dried paste film to remove the paste film in an area, where the laser beam (7) is irradiated, to form a film with a specified pattern; and baking the film with the pattern.</p> |
