| 摘要 |
<p>PURPOSE:To make it possible to deliver wafers safely and reliably without applying an unreasonable impact load to the wafers by a method wherein elastic buffer members are installed on a wafer receiving surface, on which the wafers are placed, on a tray-shaped wafer stage mounted on a handling mechanism. CONSTITUTION:Elastic buffer members 18, which are used as spring members, are ready-installed on a wafer receiving surface on a wafer stage 12 and when a wafer holding mechanism is made to descend from the upper direction in a state that a handling mechanism mounted with semiconductor wafers 15 is stood by here, the members 18 are deflected at a point of time when a static chuck is landed on the wafers 15 to absorb and relax an impact to be applied to the wafers. Moreover, in this case, even of the attitudes of the wafers 15 placed on the stage 12 are a little slanted, the attitudes of inclination of the wafers 15 are automatically corrected and the wafers are abutted on the chucking face of the chuck in parallel to the chucking face. Thereby, the wafers 15 are reliably attracted and delivered to the chuck by applying a voltage to the chuck.</p> |
