| 摘要 |
<p>PURPOSE: To make it possible to mount a semiconductor element facedown without providing metal protrusions on the element, to set resin, which is interposed between the mounting part of the element and a wiring board, at a quantitative determination, and to enhance the reliability of the electrical connection parts between the element and the wiring board. CONSTITUTION: A heating and a pressure welding are conducted interposing thermosetting resin plate 13 with plastic metal balls 14 projecting on its surface and rear between a semiconductor element 11 and a wiring board 3. As a resin is molten after the balls 14 are subjected to plastic deformation, the resin does not intrude in the connection parts between the balls 14 and the element 11 and between the balls 14 and the board 3 and the continuity failure between the element 11 and the board 3 is not caused. As the amount of the resin, which is interposed between the element 11 and the board 3, can be set at a quantitative determination, a gap, which causes intrusion of water, is prevented and spaces adjacent components is also prevented from being reduced by the squeezing-out of the resin. The plate 13 and the element 11 can be formed in parallel to each other and a lead time for the manufacture of the element 11 is shortened.</p> |
