| 摘要 |
PURPOSE:To obtain a miniature logic package of large capacity by a method wherein a card guide guiding a logic package to a housing unit of the logic package and a power feeding connector and an open-close arm provided to the innermost face of the housing are provided, and a plate spring of a good conductor provided to the arm is brought into contact with a power feeding pattern. CONSTITUTION:A well conductive plate spring 7 is provided inside a groove provided to an arm 6, which is vertically swingable about a support point 12 and provided to an upper and a lower side of a housing unit 2 respectively, where the plate springs 7 are made to face each other, the upper and the lower edge of a logic circuit 3 are inserted between the opposed well conductive plate springs 7 by moving the arms 6 inward, and the plate spring 7 is brought into contact with a power feeding pattern provided to the upper and the lower face of the logic package 3 respectively. The tip of the arm 6 is fixed to a power feeding bus bar 8 which extends from a power source provided to a rack. By this setup, a electricity sent from the power source is conducted to the arm 6 through the bus bar 8 and furthermore sent to the power feeding pattern of the logic package 3 through the intermediary of the plate spring 7 of the arm 6. |
