STRUCTURE AND MANUFACTURING METHOD OF PILLAR TYPE TRANSISTOR

摘要

The device is characterized by the features that the surroundings of a transistor pillar(6) are etched, and a base region is located in the middle of an N first heavily doped impurity layer(7) and an N second heavily doped impurity layer(20), and a base electrode is buried in a silicon substrate. The method is for reducing the parasitic junction capacitance of the base electrode and having the bidirectional operation characteristics of the transistor.