A package 100 is warped due to shrinking of moulding resin 50 when it is hardened. Thermal discord between circuit board 10 and moulding resin 50 because their thermal expansion coefficients are different from each other. This thermal discord is concentrated on the corner A of the moulding resin 50 according to stress. Accordingly, the corner A is rounded to reduce the stress applied thereto, thereby minimizing warping of the integrated circuit package 100.
