| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the complicated labor-hour by reducing the material waste as much as possible sanitarily in the case of cutting a wafer. SOLUTION: The method for manufacturing a wafer comprises the steps of supplying etching gas to the part to be cut of a crystal ingot 3, exciting the gas components by laser emitting or photon emitting, chemically reacting the component of the ingot 3 with the excited gas component to continuously volatilize and remove the part to be cut of the ingot 3 by each small area while moving the place, finally volatilizing to remove the entire part to be cut, and quarrying a wafer 10. |
