| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily realize metal plating of an independent pattern on the board side corresponding to each drive circuit by removing the extending part after plating the wiring pattern and connecting the bonding pads with the wiring pattern through a bonding wire. SOLUTION: Extending parts of wiring pattern is formed on a flexible board 105 such that they are connected electrically at the mounting position of a drive IC chip 110. After the wiring pattern is subjected to gold plating, the flexible board 105 is cut into a square and the extending parts are removed thus isolating each wiring pattern electrically. Subsequently, a drive IC chip 110 is set in the center of a removed part and bonded directly onto the upper surface of a base material 116 through silver paste. Wire bonding is performed under that state. A current limit resistor chip 111 arranged on the flexible board 105 is connected with the wiring pattern through a wire bonding 113.</p> |
