发明名称 METHOD AND APPARATUS FOR INJECTION MOLDING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To injection-fill molten resin at constant speed and uniform injection pressure respectively in the mold cavities having fitted electric parts loaded on the lead frame. SOLUTION: Heat melted resin material is supplied by injection means 40 in a required number of cylinders 70 through a hot runner 60, and by each piston 80 fitted respectively in the cylinders 70, the molten resin material is uniformly pressed respectively, thereby injection-fitting molten resin material within the cylinder in the mold cavities at constant filling speed and uniform injection pressure, so that electric parts 20 set within the mold cavities 33, 34 are seal-molded respectively in the molded article 35 in the same molding conditions.
申请公布号 JPH09141688(A) 申请公布日期 1997.06.03
申请号 JP19950326557 申请日期 1995.11.20
申请人 TOWA KK 发明人 OSADA MICHIO;ARAKI KOICHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29C45/73;B29L31/34;H01L21/56;(IPC1-7):B29C45/14 主分类号 B29C45/26
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