发明名称 PRODUCTION OF SINTERED COMPACT OF GLASS CERAMIC AND PRODUCTION OF WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide both a method for producing a sintered compact of glass ceramic which is capable of being baked with a wiring layer to be metallized with a low resistant conductive material such as Cu or Ag even with a smaller amount of glass than a conventional method and has high strength and a method for producing a wiring board. SOLUTION: This sintered compact of glass ceramic is obtained by molding mixed powder of 20-80vol.% of glass powder having 400 deg.C to 770 deg.C yield point and 1.5-8μm average particle diameter and 80-20vol.% of filler powder into a fixed shape and baking at 800-1,050 deg.C. This wiring board is obtained by molding mixed powder of 20-80vol.% of glass powder having 400 deg.C to 770 deg.C yield point and 1.5-8μm average particle diameter and 80-20vol.% of filler powder into a sheet shape, coating the surface of the sheetlike molded article with a metallizing paste and simultaneously baking the molding coated with the paste at 800-1,050 deg.C. Especially when the metallizing paste contains Cu, the simultaneous baking is carried out at 850-1,050 deg.C.
申请公布号 JPH09142879(A) 申请公布日期 1997.06.03
申请号 JP19950311008 申请日期 1995.11.29
申请人 KYOCERA CORP 发明人 HAMADA NORIAKI;YAMAGUCHI KOICHI;YONEKURA HIDETO;AZUMA MASAHIKO;TAMI YASUHIDE;FURUKUBO YOJI
分类号 C03C10/00;C04B35/20;H05K1/03;H05K3/12;(IPC1-7):C03C10/00 主分类号 C03C10/00
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