发明名称 Composite diamond wire die
摘要 A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. The wire die bore extends through both the substrate and the CVD layers, with the wire bearing surface being located within the substrate.
申请公布号 US5634369(A) 申请公布日期 1997.06.03
申请号 US19950499238 申请日期 1995.07.07
申请人 GENERAL ELECTRIC COMPANY 发明人 ANTHONY, THOMAS R.;WILLIAMS, BRADLEY E.
分类号 B21C3/02;(IPC1-7):B21C3/00 主分类号 B21C3/02
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