| 摘要 |
PROBLEM TO BE SOLVED: To obtain a fine pattern and to obtain a large high-temp. elongation percentage and a high tensile strength by roughening the deposition face of an untreated copper foil with the surface roughness identical with or smaller than that of the untreated copper foil before lustering. SOLUTION: 3-Mercaptopropane sulfonate, high molecular polysaccharides and/or a low-molecular-weight glue and a minute amt. of chloride ion are simultaneously added to an electrolyte to realize various characteristics required by a low-profile copper foil for fine patterning at a high level. Further, since the surface roughness of the deposition face of the untreated copper foil is identical with or smaller than that of the lustrous face of the untreated copper foil, the surface-treated copper foil after the deposition face is roughened keeps a low profile as compared with the conventional one, and the foil has a large etching factor. |
