| 摘要 |
A semiconductor device of the present invention includes a plurality of lead terminals extending from only one side surface of a package main body having major surfaces and side surfaces, the lead terminal extending parallel to the major surface by a predetermined size and being substantially perpendicularly bent to project from the major surface by a predetermined size in a vertical mount type semiconductor device, or being substantially perpendicularly bent to project from the major surface by a predetermined size and bent again at a distal end portion in parallel to the major surface in a horizontal mount type semiconductor device, and a supporting means projecting from the package main body by substantially the same size as the projecting size of the lead terminals. A method of manufacturing the semiconductor device of the present invention includes the steps of lead frame formation, chip mounting and bonding, mold sealing, and lead terminal formation.
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