发明名称 MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To improve the pollution recovery ratio of a molding by a method wherein the surface of a cavity for molding the molding is etched by chemical treatment and the etched surface is treated by blasting through the jetting of particulates. SOLUTION: In a molding die for molding a molding, the surface of a cavity is etched by chemical treatment and then the etched surface is treated by blasting with particulates having the particle diameter of 20-200μm. As a result, the portion having undercuts 1 and the portion having sharp corners 2 in the surface of the cavity are rounded, resulting in allowing to easily remove even when pollutant adheres to the surface and improve the pollution recovery ratio of the molding. Accordingly, by employing this molding die, the moldings excellent in pollution resistance and improved in external designedness such as floor material, wall material, bathtub or the like can be molded.
申请公布号 JPH09141664(A) 申请公布日期 1997.06.03
申请号 JP19950304758 申请日期 1995.11.22
申请人 SEKISUI CHEM CO LTD 发明人 OOTANI MASUHISA
分类号 B29C33/38;B29C43/36;B29C45/37;(IPC1-7):B29C33/38 主分类号 B29C33/38
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