发明名称 COOLING DEVICE IN HEAT TREATMENT APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To efficiently cool a number of materials of different kinds to be heat-treated by enabling to change the sizes of plural coolant ejection holes arranged to faced surfaces of a hollow heating coil and a cooling coil and to change the ejection pressure and quantity of the coolant. SOLUTION: One pair of the hollow semi-cylindrical type heating and cooling coils 1, 1 provided with electrode copper parts 5 arranged through an insulating plate 6 are arranged in mutually facing state, and the material to be heat-treated is arranged between the coils. After induction-heating the material to be heat- treated, the coolant introduced from a supplying pipe 3 is ejected from the ejection holes through a hollow part of the coil 1 to cool the material to be heat-treated. In this heat treatment apparatus, one pair of movable rings 2 having plural coolant ejection holes 8 are arranged before the coil 1. Overlapping area of the coolant ejection holes 7, 8 are adjusted by shifting the movable rings 2 in the longitudinal direction, and the ejection pressure and quantity of the coolant are changed according to the material to be heat-treated.</p>
申请公布号 JPH09143548(A) 申请公布日期 1997.06.03
申请号 JP19950306088 申请日期 1995.11.24
申请人 HITACHI KOKI CO LTD 发明人 KAMIMURA JUNICHI;SATO ITSUO;ABE TAKAO
分类号 C21D1/10;(IPC1-7):C21D1/10 主分类号 C21D1/10
代理机构 代理人
主权项
地址