| 摘要 |
A method is described that electrically plates only desired parts in order to fabricate vibration mass. A Ni film is deposited on a silicon substrate 1 and then a Ni pattern 2 is defined by photo-resist. A Ni silicide 3 is formed by annealing using RTP method and then a mass paddle region is defined by photo-resist 4 of spin-on type prior to a hard bake. A film photo-resist 5 and 6 are formed on the photo-resist 4 in order to define a mass paddle region. Thereafter, a Ni oxide layer on the Ni silicide 3 is removed by such as NH4OH and then vibration mass 7 is formed by Ni electro plating and thus the film photo-resist 5 and 6 and photo-resist 4 are removed. The Ni silicide 3 can be NiSi layer or NiSi2 layer. Thereby, it is possible to fabricate several types of sensors having mass different from each other over one chip.
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