发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENTS
摘要 <p>For solving a problem of large dependency of peel-off strength upon sealing conditions, a problem of change of various properties with the lapse of time under storing circumstances, a delamination problem, an agglomerate problem and a transparency problem, there is provided a cover tape for packaging electronic components which has a stable peel-off strength and is composed of an outer layer consisting of a biaxially oriented film of any one of polyester, polypropylene and nylon; an intermediate layer consisting of a mixture comprising polyethylene as the main component; and a heat sealant layer consisting of a mixture of a thermoplastic resin and a filler.</p>
申请公布号 WO1997019140(A1) 申请公布日期 1997.05.29
申请号 JP1996003376 申请日期 1996.11.18
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