发明名称 MOLDABLE THERMOPLASTIC RESIN COMPOSITION
摘要 <p>The invention relates to a moldable thermoplastic resin composition comprising: (a) 99.25-25 % by weight of at least one polyamide-containing compound; (b) 0.05-5 % by weight of at least one compound selected from the group consisting of magnesium-, zinc- and aluminium salts, and optionally (c) 0-70 % by weight of at least one additive compound, which resin composition has an apparent melt viscosity according to ISO 11443 of less than 100 Pa.s, at a shear rate of 1000 s(-1) and at 0.1 % by weight moisture content of the resin composition in the form of granules. This invention furthermore relates to molded articles comprising such a thermoplastic resin composition.</p>
申请公布号 WO1997019131(A1) 申请公布日期 1997.05.29
申请号 US1996018458 申请日期 1996.11.15
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