| 摘要 |
A semiconductor device comprises a plurality of circuits (11a to 11c) formed on an IC chip area (10), having electric power systems each being independent, a plurality of power potential supply wires (12a to 12c) connected to the plurality of circuits, respectively, a plurality of power potential supply terminals (14a to 14c) connected to the plurality of power potential supply wires, respectively, at least one pad (18) for voltage stress test formed on the IC chip area, and controllers (17a, 17b) for controlling a predetermined voltage stress to be applied from one of the plurality of power potential supply terminals to all power potential supply wires on the IC chip area by use of an input from the pad for voltage stress test. <IMAGE> |
