CHIP MODULE

摘要

The invention concerns a chip module having a contact layer (2) produced from an electrically conductive material and having a plurality of contact elements (4) and a semiconductor chip (7) with chip connections which are disposed on the main surface (5) of the semiconductor chip (7) and are each electrically connected to a contact element (4) of the contact layer (2). Furthermore, provided on the surface of the electrically conductive contact layer (2) facing the semiconductor chip (7) is a thin insulation film (10) of electrically insulating material which has an adhesive or bonding function both on its front face facing the contact layer (2) and on its rear face (8) remote from the contact layer (2).