Simultaneous parallel encapsulator for optical diodes

摘要

A unit encapsulates electronic components. The encapsulation compound (1) e.g. resin is supplied to the inlet (2), and induced into the suction- and compression chamber (5), i.e. the cylinder, within the casing (4). An appropriately-sized dosing volume (6) of the resin is injected through the nozzle (7) into the casting mould (8) by the piston stroke. The dosing volume (6) is adjustable. The unit has multiple parallel cylinders (5), dosing volumes (6), pistons (3) and nozzles (7). Preferably, there is a rotary valve between the inlet and cylinder which has T-shaped passages which are drilled at an angle of 75-105 deg with respect to each other. An overflow receptacle removes air bubbles trapped in the resin. A cylinder raises or lowers the casting mould and the end positions of the cylinder are detected by proximity switches. Further proximity switches detect the casting position of the mould, the end positions of the delivery piston and the orientation of the rotary valves.