Apparatus and method for double-side polishing semiconductor wafers

摘要

In double-side polishing of semiconductor wafers W, not only the two main surfaces but also surface of the edge portion 42 can be polished in one operation with cost reduction and freedom from contamination. An apparatus 22 with twin polishing turn tables 24, 26 is used in the double-side polishing and the inner peripheral edge of each carrier hole 34 formed in a wafer carrier 32 is profiled such that the sectional profile of the inner peripheral edge is substantially the copy of the edge 42 of the wafer W placed in the hole 34.