| 摘要 |
A multilayer stencil is disclosed for applying solder paste to a printed circuit board. The stencil is formed from first and second layers (32,34) of stencil material e.g. stainless steel sheet, the second layer (34) overlying the first layer (32) in selected areas thereby forming a region of increased stencil thickness in those areas. A first plurality of apertures is defined through the thickness of the first layer only and a second plurality of apertures is defined through the combined thickness of the first and second layers in the selected regions. This type of multilevel stencil is useful for depositing differing thicknesses of solder paste onto a circuit board comprising a hybrid of through-hole and SMT devices. |
