| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to obtain assembly performance with high accuracy by operating an optical semiconductor package, monitoring the coupling efficiency of a cap with a lens and an optical fiber and welding and fixing the package and cap while adding a correction thereto. SOLUTION: The optical semiconductor package 1 is operated, by which light is emitted from an optical semiconductor chip 4 and is made incident on the optical fiber 6 through the lens 3. The cap 2 with the lens 3 is actuated in X-Y directions by a biaxial table controller 12 and a biaxial table 11 according to the instruction from a peak search controller 16. A module base body 5 and the optical fiber 6 are operated in X-Y-Z directions by a triaxial table controller 14 and a triaxial table 13. A welding power source 9, a YAG laser emitting optical system 17 and a YAG oscillator 18 are started to weld and fix the optical semiconductor package 1 and the cap 2 with the lens at the point of the time the prescribed coupling efficiency is obtd.</p> |
