| 发明名称 |
Process for preparing a non-conductive substrate for electroplating |
| 摘要 |
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
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| 申请公布号 |
US5632927(A) |
申请公布日期 |
1997.05.27 |
| 申请号 |
US19960603606 |
申请日期 |
1996.02.21 |
| 申请人 |
MACDERMID, INCORPORATED |
发明人 |
FERRIER, DONALD;MARTINEZ, ROSA;YAKOBSON, ERIC |
| 分类号 |
C25D5/54;C25D7/00;C25D15/02;C25D21/14;H05K3/18;H05K3/42;(IPC1-7):H01B1/04;H01B1/06;C09C1/44;C25D5/02 |
主分类号 |
C25D5/54 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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