SEMICONDUCTOR DEVICE WITH HEAT RADIATING FIN, AND MOUNTING/DISMOUNTING METHOD FOR THE DEVICE

摘要

PROBLEM TO BE SOLVED: To increase mounting reliability and reduce mounting/dismounting work time. SOLUTION: The device includes a both-face-wired substrate (base) 12 having mounting bump electrodes 10 mounted on its one side and having an LSI chip 12 mounted on the other side, a heat radiating fin 2 contacted directly with the LSI chip 12 or contacted with it through a heat conductor, and fixing means for removably mounting the heat radiating fin 3 to the base 13. A reinforcing member is fastened to the base 13 and the heat radiating fin 3 is fastened to the reinforcing member by the fixing means. The fixing means has a screw structure where the heat radiating fin 3 is fixed on the reinforcing member by screws 4.