| 摘要 |
A film treating method treats a resist film which is formed on a substrate by spin coating. The method comprises a step for coating resist on the substrate to form the resist film, a step for conveying the substrate to a region having an atmosphere of a saturated vapor or a super-saturated vapor of solvent before the solvent contained in the resist film is lost, a step for executing a first heating process wherein the substrate is heated at a temperature which lowers the viscosity of the resist film and permits solvent to remain in the resist film in an amount sufficient to maintain the fluidity of the resist film, a step for conveying the substrate away from the region having the atmosphere of the saturated vapor or the super-saturated vapor of solvent, and a step for executing a second heating process wherein the substrate is heated at a temperature higher than that of the first heating process, thereby permitting the solvent to evaporate from the resist film.
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