METHOD FOR PLATING ELECTRONIC PARTS,申请号JP19950292371-传众专利搜索

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发明名称	METHOD FOR PLATING ELECTRONIC PARTS
摘要
申请公布号	JPH09137296(A)	申请公布日期	1997.05.27
申请号	JP19950292371	申请日期	1995.11.10
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	ISHIKAWA IWAO;BABA YASUTAKA
分类号	C25D17/26;(IPC1-7):C25D17/26	主分类号	C25D17/26
代理机构		代理人
主权项
地址

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