发明名称 WAFER CARRYING PARTS AND WAFER CARRYING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To transfer a substrate without damage, and to lessen the generation of particles by a method wherein the first layer, having a substrate retaining part with a substrate attraction hole and an air suction hole, is composed of flexible high molecular member having the Rockwell hardness of a specific range. SOLUTION: The substrate, which is mounted on a substrate holding part 8, is retained by suction by giving negative pressure to a substrate sucking hole 5 through an air-introducing path 7 from an air suction hole 6 connected to a sucking device. At this time, the substrate holding part 8, consisting of a flexible polymer plate member with Rockwell hardness value of 80 to 350 and having a substrate suction hole 5, are formed on the first layer 2. Also, the second layer 3, having a suction air introducing path 7 is formed in proximity with the first layer 2, and the third layer 3 having a suction air introducing path 7, is formed. As a result, the damage given to the surface of the substrate by the contact and the friction with device surface can be lessened, and the generation of particles can also be reduced.</p>
申请公布号 JPH09139413(A) 申请公布日期 1997.05.27
申请号 JP19950295803 申请日期 1995.11.14
申请人 DU PONT KK;FURORO MECH KK 发明人 TAKAHASHI KIYOSHI;MARUYAMA YUICHI;SAKAI SHUJI
分类号 B65G49/07;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
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