| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance a yield by forming an emitter layer on a conductive substrate by using as a mask a metal thin plate in which an insulating layer and a self-sacrifice layer are formed and after that, eliminating the self-sacrifice layer to lower dimensional accuracy in working an electrode. SOLUTION: A metal thin plate is etched by photolithograpy and the hole 11 of a predetermined pattern is perforated to obtain a lead-out electrode. Next, an insulating layer 12 and a self-sacrifice layer 13 are formed by using as a pattern the hole 11 of the metal thin plate 10. The metal thin plate 10 and a conductive substrate 14 are faced against each other and an emitter layer 16 is deposited from the upper side of the metal thin plate 10 by a sputtering method and after that, the self-sacrifice layer 13 is removed by etching.</p> |
