The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.
申请公布号
US5633034(A)
申请公布日期
1997.05.27
申请号
US19960645019
申请日期
1996.05.09
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CARTER, KENNETH R.;DIPIETRO, RICHARD A.;HEDRICK, JAMES L.;HUMMEL, JOHN P.;MILLER, ROBERT D.;SANCHEZ, MARTHA I.;VOLKSEN, WILLI;YOON, DO Y.