发明名称 ELECTRONIC COMPONENT INSERTION DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the generation of a gap between groove parts and lead wires by a method wherein the groove parts are formed in the points of pushers, which can pinch the lead wires, the groove parts are formed in a depth of a dimension smaller than the wire diameter of the thinnest lead wire among the lead wires, which are inserted in a board, and the distance between the board and the pushers is adjustable according to the thickness of the lead wires. SOLUTION: The depth of groove parts 32 formed in pushers 11 is set in a dimension equal with the wire diameter of the thinnest lead wire 12A among lead wires. A very small difference H is generated between the heights of the pushers 11 by a difference between the wire diameters of the wire 12A and a lead wire 12B, but the difference H can be adjusted by moving up and down the position of the fulcrum of an arm 23 by a very small amount by rotating an eccentric axis 43 by a rotationally driving part 44. By manufacturing an electronic component insertion device into such a constitution, when lead wires 12 are inserted between the pushers 1 and a receiving lever 14 and are shaped, the generation of a gap can be prevented between the groove parts 32 formed in the pushers 11 and the lead wires 12A and 12B also in the case where the lead wire 12 is thin 12A and also in the case where the lead wire 12 is thick 12B.
申请公布号 JPH09139598(A) 申请公布日期 1997.05.27
申请号 JP19950295866 申请日期 1995.11.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRAMOTO KOJI;ISHII TAIRA
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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