发明名称 POLYAMIDE FILM FOR THERMALLY FIXING RAW MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain the above film, having excellent heat resistance, mechanical characteristics and dimensional stability and suitable as a thermal fixing roll for high speed or energy conservation type printer, etc., from an amorphous thermoplastic polyimide containing an inorganic filler having thermal conductivity and having a specific structural unit. SOLUTION: This film is obtained from (B) an amorphous thermoplastic polyimide containing (A) an inorganic filter having thermal conductivity and the component B contains 1-80mol% structural unit of formula I and 99-60mol% structural unit of formula II and the film is composed of 90-60wt.% component B and 10-40wt.% component A. Furthermore, the logarithmic viscosity of the component B solution is 0.45-0.7g/dl at 30 deg.C and the component A is boron nitride or aluminum nitride and has 0. 1-10μm average particle diameter and preferably, the film has 10-100μm thickness, 230-260 deg.C glass transition temperature and <=4×10<-5> / deg.C coefficient of linear expansion (at 25-220 deg.C) and 4-10GPa modulus (at 200 deg.C) and 0.2-0.6W/m.K thermal conductivity (at 50 deg.C).
申请公布号 JPH09137060(A) 申请公布日期 1997.05.27
申请号 JP19950296543 申请日期 1995.11.15
申请人 MITSUI TOATSU CHEM INC 发明人 KATSUYAMA HITOSHI;OTA YASUHIKO;SARUWATARI MASUMI;KUMAMOTO YUKIHIRO
分类号 G03G15/20;C08J5/18;C08K3/28;C08K3/38;C08L79/08;(IPC1-7):C08L79/08 主分类号 G03G15/20
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