| 摘要 |
An interconnection apparatus for providing solderless, three dimensional microwave interconnection from a planar suspended substrate stripline network to MIC modules using three wire transmission line input/output ports. The apparatus includes in sequence a coaxial line transition which is coupled to the stripline center conductor, a slabline transition coupled to the coaxial line transition. A center conductor having a constant diameter extends through the coaxial and slabline transition. A short three wire transition couples the slabline transition to the three wire transmission line input/output port, and uses compressible conductors as the wire elements to provide a robust solderless connection to the three wire transmission line port.
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