发明名称 |
Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits |
摘要 |
Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.
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申请公布号 |
US5633480(A) |
申请公布日期 |
1997.05.27 |
申请号 |
US19950539336 |
申请日期 |
1995.10.04 |
申请人 |
CMK CORPORATION |
发明人 |
SATO, HIROMOTO;SHIRAI, JUNZABURO |
分类号 |
H05K1/02;H05K1/03;H05K3/00;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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