发明名称 WAFER-ALIGNING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer-aligning device in which the generation of dust is negligible. SOLUTION: A water-aligning device comprises a vertically movably notch 17 that consists of a shaft 47 and a notch roller attached loosely to the shaft to align wafer 5, which have a cut in the periphery 6 and stored in a carrier 1. The notch roller is divided into plural wafers 5 so as to correspond to individual wafers 5. When moved upward, the notch roller comes into contact with wafer peripheries and engages with the cuts 7 in the peripheries of the wafers 5 that are rotated by a drive roller 15, so that the wafers 5 are aligned in predetermined positions.</p>
申请公布号 JPH09139416(A) 申请公布日期 1997.05.27
申请号 JP19950321246 申请日期 1995.11.16
申请人 PLUS SEIKI KK 发明人 SUGAWARA SUMIO;SUZUKI KENJI
分类号 B65H31/24;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65H31/24
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