OPTICAL SEMICONDUCTOR ARRAY MODULE AND ITS ASSEMBLING METHOD AS WELL AS PACKAGING STRUCTURE FOR EXTERNAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To improve the mounting of an external circuit board and members for heat radiation and the stabilize and assure the reliability and optical coupling of internal optical semiconductor array elements. SOLUTION: A laser diode array 1 is fixed atop a stem 4 constituting a package case. An IC 2 for driving the array is fixed onto the internal circuit board 5 and is connected by wire bonding leads 13. A lens array plate supplying member 7 which supports and fixes the lens array plate 6 is inserted into the through-hole 9a of the side wall 9 of the package case and is so adjusted that the optical axial lines of the laser diode array 1 and the lens array plate 6 are aligned. The array and the array plate are thereafter joined and fixed by YAG laser welding and further, a cap 10 is joined and fixed to the top end of the side wall 9 to provide hermetic sealing and to fix the optical fiber array 3 inserted into the optical fiber array guide 8. Pin terminals 11 are formed as a pin grid array terminal shape to a part of the internal circuit board 5 forming a part of the package case. The optical semiconductor array module is electrically and mechanically connected to the external circuit board via these terminals.