| 摘要 |
The photosensitive resin composition of the present invention uses, as the characteristic feature, a modified epoxy resin product obtained by reacting a novolak epoxy resin with an unsaturated monocarboxylic acid in an amount of 30 to 70 % by mol per equivalent of the epoxy group in the novolak epoxy resin in the presence of a trivalent organic phosphorus compound as the catalyst; deactivating the catalytic action of the organic phosphorus compound; and then reacting the resulting reaction product with a polycarboxylic acid anhydride in an amount of 10 to 70 % by mol per equivalent of the epoxy group in the starting novolak epoxy resin and the modified epoxy resin product having an epoxy group, an unsaturated group and a carboxyl group at a mol ratio of the epoxy group: the unsaturated group: the carboxyl group in the molecule being 30 SIMILAR 70 : 30 SIMILAR 70 : 10 SIMILAR 70, as the base resin. |
