| 摘要 |
A rigid substrate interposer, 49 is mounted in a leadframe in place of a conventional integrated circuit die. Interposer bonding pads 50 at the periphery of the substrate are connected to bond fingers 56 of the leadframe, e.g., by wire bonds 54. The interposer bonding pads are electrically connected to the die using a network of routing lines 52 connected to a central array of interposer array pads. The array of interposer array pads is connected to a corresponding array of die array pads on the die using metal bumps. |
