发明名称 |
Printing wiring board and assembly of the same |
摘要 |
<p>A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess (10) is formed in one part of a PWB (1) and components (4, 4') are received in this recess (10). The components (4, 4') are lower than the surface of the PWB (1). A conductive pad (3) is provided to the bottom of the recess (10) and a connecting terminal (4a) and the conductive pad (3) are electrically connected by using a solder ball (11) or a conductive adhesive material. The recess (10) is formed by partially removing one or more layers of plural conductive layers and insulating layers which make up the multilayer PWB (1). <IMAGE></p> |
申请公布号 |
EP0774888(A2) |
申请公布日期 |
1997.05.21 |
申请号 |
EP19960118388 |
申请日期 |
1996.11.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
NISHIYAMA, TOUSAKU |
分类号 |
H05K1/16;H05K1/18;H05K3/46;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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