| 摘要 |
Electronic component packaging comprises a multi-layer printed circuit board structure defining, on an outer surface of a first substrate (10), a first array of contacts (14) connected to the electronic component (16) and, on an outer surface of a second substrate (12), a second array of contacts (28) for connection to an electronic circuit. The first array of contacts (14) and is connected to conductive tracks (20) also formed on the outer surface of the first substrate (10). The conductive tracks (20) are selectively connected to appropriate contacts (28) of the second array by conductive blind vias (24) extending through the first substrate (10) and connected by conductive tracks (22) arranged between the first (10) and second (12) substrates wherein substantially all of the connections to the electronic component (16) are connected to the first array of contacts (14). |
