Method and apparatus of testing an integrated circuit device

摘要

A method and apparatus for testing an integrated circuit device. An integrated circuit device undergoes testing in at least two different stages of the manufacturing process. At one stage, the semiconductor wafer containing multiple chip dice is probed by a probe tester that tests each of the dice individually. At another stage, after an individual chip die has been encapsulated in a package, a package tester tests and exercises the functions of the chip.