A heat sink assembly for a multi-chip module

摘要

A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a heat sink such as finned aluminum by thermal paste. The plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion. Relatively low-power chips may be thermally coupled to the plate by thermal paste instead of being bonded by solder.