| 摘要 |
PROBLEM TO BE SOLVED: To prevent the excessive leakage of an adhesive means at the bonding of a semiconductor chip, by providing one lead with a coupling bar, out of the leads positioned in four directions on the topside of a heat sink. SOLUTION: A coupling bar CB is provided sideways at the head face of the lead Is positioned at the middle part, out of leads I positioned in four directions, and the coupling bar CB is bonded to a heat sink HS, making use of an adhesive means T1 such as a quadrangular tape, etc., and other leads 1, etc., are bonded to auxiliary adhesive means T2 such as tape pieces, etc., bonded to the four sides of the heat sink. Therefore, by the four pieces of coupling bars CB provided sideways at the head faces of the leads is being coupled with one another, this maintains the form of a quadrangular guide ring, and can prevent the leakage caused by excessive application of epoxy resin, etc., as a pseudo chip adhesive means at the time of bonding of a semiconductor chip. Moreover, the thermal transformation can be prevented by providing a guide ring. |
