| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable easy coincidence between CAD data and a setting reference point of a wiring bonding device, by forming at least a part of an edge of a semiconductor chip setting surface of a die pad nearly at right angles. SOLUTION: An edge of a semiconductor chip setting surface 2a is formed by a curved surface 2b in a curved shape, while a land of a diagonal portion on the semiconductor chip setting surface 2a is formed as a right-angle land 2c which is nearly at right angles. Reference points of a die pad 2 and a semiconductor chip 1 set on a wire bonding device are set. Thus, reference points A and B of the die pad 2 and reference points C and D of the semiconductor chip 1 set in CAD data may be made coincident. Therefore, in wire bonding operation for bonding a connection electrode on the semiconductor chip 1 and a lead, automation based on the CAD data is enabled and reduction in the number of man-hours for the wire bonding operation may be realized.</p> |
