Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints

摘要

The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.